Odjel za teoriju i primjenu mikrovalova
Znanstveni centar izvrsnosti za znanost o podatcima i kooperativne sustave (ZCI-DATACROSS), Zavod za radiokomunikacije, Odjel za antene i širenje elektromagnetskih valova (APS), Odjel za teoriju i primjenu mikrovalova (MTT) i Zajednički odjel za zrakoplovne elektroničke sustave te geoznanosti i daljinska istraživanja (AES/GRS) Hrvatske sekcije IEEE te Odjel komunikacijskih sustava HATZ pozivaju vas na predavanje :
What butterflies and FBG sensors have in common
and why PICs made Iphone X so expensive
koje će održati dr. sc. Ivan-Lazar Bundalo, Tyndall National Institute, Cork, Irska. Predavanje će se održati u utorak 30. listopada 2018. godine u 15:00 sati u Seminaru Zavoda za radiokomunikacije FER-a (soba C12-02), zgrada C, 12. kat.
Sažetak predavanja i životopis predavača nalaze se u nastavku obavijesti.
The first part of the lecture will be about Microstructured Plastic Optical Fibers (mPOFs) and Fiber Bragg Grating technology. How this technology reflects nature and can be used for sensing humidity, temperature and strain. The second part of the lecture will be about Photonic Integrated Circuits (PICs), and the difficulty of integrating these powerful miniature optical devices into macroscopic systems.
Ivan-Lazar Bundalo was born in 1988, in Zagreb, Croatia. He obtained his bachelor’s from the Faculty of Electrical Engineering at University of Zagreb, with Major in Electronics. He received a scholarship and completed the EU funded “Europhotonics” master’s program, involving Université d'Aix-Marseille (France), Karlsruhe Institute of Technology (Germany), Universitat Politècnica de Catalunya and Universitat de Barcelona (Spain).
In 2013 he started his doctorate studies at Technical University of Denmark, developing polymer optical fibre sensors. During his Ph.D. work he attended several international conferences in Europe and the US, and had a 5-month research stay at the University of Sydney, Australia, where he worked on an all-plastic medical endoscope.
Currently, he is working on PIXAPP - photonics packaging pilot line, at Tyndall National Institute in Cork, Ireland. The focus of his work is developing and standardizing the technology for integration of Photonic Integrated Circuits.